Integrated circuit packaging system with isolated pads and method of manufacture thereof

ABSTRACT

A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of U.S. Provisional PatentApplication Ser. No. 61/057,203 filed May 30, 2008, and the subjectmatter thereof is incorporated herein by reference thereto.

TECHNICAL FIELD

The present invention relates generally to an integrated circuitpackaging system, and more particularly to a system with isolated pads.

BACKGROUND ART

Increased miniaturization of components, greater packaging density of anintegrated circuit die (“IC”), higher performance, and lower cost areongoing goals of the computer industry. IC package technology continuesadvances in miniaturization to increase density of integrated circuit orsemiconductor components within these packages. The miniaturization ofIC packages decreases sizes of products made from these packages inresponse to continually increasing demands for information andcommunication products in ever-reduced sizes, thicknesses, and costs,along with ever-increasing performance.

These increasing requirements for miniaturization are particularlynoteworthy, for example, in portable information and communicationdevices such as cellular phones, hands-free cellular phone headsets,personal data assistants (“PDA's”), camcorders, notebook computers, andso forth. All of these devices continue to be made smaller and thinnerto improve their portability. Accordingly, a large-scale integratedcircuit (“LSI”) within an IC package is required to be made smaller andthinner. The LSI package configurations that house and protect the LSIare required to be made smaller and thinner as well.

Many conventional packages for integrated circuits, semiconductors orchips are of the type where a semiconductor die is molded into a packagewith a resin, such as an epoxy molding compound. These packages have alead frame whose leads are projected from the package body to provide apath for signal transfer between the die and external devices.

Other conventional package configurations have contact terminals or padsformed directly on the surface of the package. Such a conventionalsemiconductor package is fabricated through the following processes: adie-bonding process (mounting the semiconductor die onto the paddle of alead frame), a wire-bonding process (electrically connecting thesemiconductor die on the paddle to inner leads using lead frame wires),a molding process (encapsulating a predetermined portion of theassembly, containing the die, inner leads and lead frame wires, with anepoxy resin to form a package body), and a trimming process (completingeach assembly as individual, independent packages).

The semiconductor packages thus manufactured are then mounted bymatching and soldering the external leads or contact pads of the packageto a matching pattern on a circuit board to enable power and signalinput/output (“I/O”) operations between the semiconductor devices in thepackages and the circuit board.

Different challenges arise from increased function integration andminiaturization. For example, a semiconductor product having increasedfunction may be smaller but still require a large number ofinputs/outputs (I/O). The size reduction increases the I/O density ordecreases the I/O pitch for the integrated circuit die package and itsrespective integrated circuit die carriers.

The ever-increasing I/O density trend presents a myriad of manufacturingproblems. Some of these problems reside in the IC die manufacturingrealm, such as fine pitch connections and reliability of theseconnections. Others problems involve mounting these increase I/O densityintegrated circuit dies on carriers for packaging. Yet other problemsreside in the realm of the printed circuit board or the system boardthat receives the integrated circuit die package having the fine pitchI/O or a large number of I/Os in an ever-shrinking space.

Thus, a need still remains for an integrated circuit die package systemproviding low cost manufacturing, improved yield, and improvedreliability. In view of the ever-increasing need to save costs andimprove efficiencies, it is more and more critical that answers be foundto these problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method of manufacture of an integratedcircuit die packaging system including: providing a lead frame having adie attach paddle, an isolated pad, and a connector; attaching anintegrated circuit die to the die attach paddle and the connector;forming an encapsulation over the integrated circuit die, the connector,the die attach paddle, and the isolated pad; and singulating theconnector and the die attach paddle whereby the isolated pads areelectrically isolated.

The present invention provides an integrated circuit die packagingsystem including: a die attach paddle; an isolated pad adjacent the dieattach paddle; a connector near the isolated pad and the die attachpaddle; an integrated circuit die attached to the die attach paddle andthe connector; an encapsulation over the integrated circuit die, theconnector, the die attach paddle, and the isolated pad with theconnector, the die attach paddle, and the isolated pads electricallyisolated having sides of the die attach paddle with characteristics of aformation process.

Certain embodiments of the invention have other steps or elements inaddition to or in place of those mentioned above. The steps or elementwill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of an integrated circuit packaging system in afirst embodiment of the present invention.

FIG. 2 is a bottom plan view of the integrated circuit packaging system.

FIG. 3 is a cross-sectional view of the integrated circuit packagingsystem taken along line 3-3 of FIG. 1.

FIG. 4 is a top plan view of an integrated circuit packaging system in aframe formation phase of a second embodiment of the present invention.

FIG. 5 is a cross-sectional view of the integrated circuit packagingsystem taken along line 5-5 of FIG. 4.

FIG. 6 is a cross-sectional view of the integrated circuit packagingsystem taken along line 6-6 of FIG. 4.

FIG. 7 is a cross-sectional view of an integrated circuit packagingsystem in a third embodiment of the present invention.

FIG. 8 is a cross-sectional view of an integrated circuit packagingsystem in a fourth embodiment of the present invention.

FIG. 9 is a cross-sectional view of an integrated circuit packagingsystem in a fifth embodiment of the present invention.

FIG. 10 is a cross-sectional view of an integrated circuit packagingsystem in a sixth embodiment of the present invention taken along line10--10 of FIG. 11.

FIG. 11 is a bottom plan view of the integrated circuit packagingsystem.

FIG. 12 is a top plan view of the integrated circuit packaging system ina frame formation phase.

FIG. 13 is a top plan view of an integrated circuit packaging system ina frame formation phase of a seventh embodiment of the presentinvention.

FIG. 14 is a bottom plan view of an integrated circuit packaging systemin an eighth embodiment of the present invention.

FIG. 15 is a bottom plan view of an integrated circuit packaging systemin a ninth embodiment of the present invention.

FIG. 16 is a bottom plan view of an integrated circuit packaging systemin a tenth embodiment of the present invention.

FIG. 17 is a top plan view of an integrated circuit packaging system inan eleventh embodiment of the present invention.

FIG. 18 is a bottom plan view of the integrated circuit packagingsystem.

FIG. 19 is a cross-sectional view of the integrated circuit packagingsystem taken along line 19-19 of FIG. 17.

FIG. 20 is a flow chart of a method of manufacture of an integratedcircuit packaging system in a further embodiment of the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following embodiments are described in sufficient detail to enablethose skilled in the art to make and use the invention. It is to beunderstood that other embodiments would be evident based on the presentdisclosure, and that system, process, or mechanical changes may be madewithout departing from the scope of the present invention.

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail.

The drawings showing embodiments of the system are semi-diagrammatic andnot to scale and, particularly, some of the dimensions are for theclarity of presentation and are shown exaggerated in the drawing FIGs.Similarly, although the views in the drawings for ease of descriptiongenerally show similar orientations, this depiction in the FIGs. isarbitrary for the most part. Generally, the invention can be operated inany orientation.

The same numbers are used in all the drawing FIGs. to relate to the sameelements. The embodiments have been numbered first embodiment, secondembodiment, etc. as a matter of descriptive convenience and are notintended to have any other significance or provide limitations for thepresent invention.

For expository purposes, the term “horizontal” as used herein is definedas a plane parallel to the plane or surface of the die attach paddle,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “above”,“below”, “bottom”, “top”, “side” (as in “sidewall”), “higher”, “lower”,“upper”, “over”, and “under”, are defined with respect to the horizontalplane, as shown in the figures. The term “on” means that there is directcontact among elements.

The term “processing” as used herein includes deposition of material orphotoresist, patterning, exposure, development, etching, cleaning,and/or removal of the material or photoresist as required in forming adescribed structure.

Referring now to FIG. 1, therein is shown a top view of an integratedcircuit packaging system 100 in a first embodiment of the presentinvention. The top view depicts an encapsulation 102, such as an epoxymolded compound, having an encapsulation first side 104. Externalconnectors 106 are partially exposed and extended peripherally from theencapsulation 102. The external connectors 106, for example, can beleads, external connections, or external conductors, for the integratedcircuit packaging system 100 in a quad flat package type.

It has been discovered that the integrated circuit packaging system 100provides significantly increased input/output capacity, multiple chipintegration, or ease of assembly without increasing thickness ofpackages. This aspect can assist in integration of dissimilartechnologies such as memory and sequential logic integrated circuits. Inaddition the integrated circuit packaging system 100 limits oreliminates cutting pads preventing delamination associated with sawingpackages.

Referring now to FIG. 2, therein is shown a bottom plan view of theintegrated circuit packaging system 100. The bottom view depicts theencapsulation 102 with an encapsulation second side 208. The externalconnectors 106 are partially exposed and extending peripherally from theencapsulation second side 208. The bottom view also depicts a die attachpaddle 210, such as a conductive or non-conductive platform onto whichan integrated circuit can be mounted. The encapsulation second side 208can provide the die attach paddle 210 substantially exposed orsubstantially covered.

Isolated pads 212, such as die attach pad extensions, elongated pads, anarray of pads, or staggered pads, can be formed of conductive materialssuch as copper or tungsten. The isolated pads 212 can be formed having alength approximately the same as a length of the die attach paddle 210and preferably having a width less than half of the length. The sidealong the length of the isolated pads 212 can preferable besubstantially parallel to an adjacent or a facing side of the die attachpaddle 210. The isolated pads 212 can be substantially surrounded by andformed within a periphery of the encapsulation 102. A side of theisolated pads 212 can be substantially exposed from the encapsulationsecond side 208.

For example, the isolated pads 212 can be formed to provide connectionregions similar to the die attach paddle 210 for down bonds or groundconnections. Forming the isolated pads 212 having a spacing orseparation from the die attach paddle 210 eliminates delamination of thedie attach paddle 210 from singulation or separation processes such assawing, cutting, or etching.

The isolated pads 212 can be electrically isolated from the die attachpaddle 210 without applying separation or singulation processes to sidesof the die attach paddle 210 whereby the die attach paddle 210 maintainscharacteristics of a formation process. The structural integrity ofsides the die attach paddle 210 from the formation process can bepreserved without applying further separation or singulation processesto the sides for isolating additional pads or pad segments.

It has been discovered that the integrated circuit packaging system 100provides more signal I/O pins or potential reduction of package size,similar thermal performance to exposed-pad quad flat pack packages, oroptimized PCB routing.

Referring now to FIG. 3, therein is shown a cross-sectional view of theintegrated circuit packaging system 100 taken along line 3--3 of FIG. 1.The cross-sectional view depicts the encapsulation 102 with the externalconnectors 106 extending from a lateral side 314 of the encapsulation102.

The external connectors 106 are connected to dam bars 316, such as atemporary metal bar used to inhibit the flow of plastic or provide asubstantially fixed location for components during the molding process.The dam bars 316 can be connected to internal connectors 318, such asleads, external connections, or external conductors, covered by theencapsulation 102.

The dam bars 316 can also be connected to the isolated pads 212 by fusedconnectors 320, such as bars of conductive material such as copper ortungsten. Preferably the fused connectors 320 are down set, such asextending from an upper location to a lower location, so that the fusedconnectors 320 can connect to the isolated pads 212. For example, theisolated pads 212 can be formed in a different plane and not coplanar toa plane of the dam bars 316 whereby a down set of the fused connectors320 extends from an upper plane of the dam bars 316 to a lower plane ofthe isolated pads 212. The isolated pads 212 can be formed adjacent orfacing the die attach paddle 210.

The cross-sectional view further depicts an integrated circuit die 322,such as a microchip or a flip chip, attached to the die attach paddle210 with an adhesive 324. Electrical interconnects 326, such as bondwires or ribbon bonds, electrically attach the integrated circuit die322, the die attach paddle 210, the isolated pads 212 and the internalconnectors 318. It is understood that the isolated pads 212 can beelectrically connected to various signals such as reference source,signals, power, or ground.

The encapsulation 102 covers the integrated circuit die 322 and theelectrical interconnects 326. The encapsulation 102 can partially coverthe die attach paddle 210 and the isolated pads 212 exposing a side ofthe die attach paddle 210 or the isolated pads 212 from theencapsulation second side 208. A removal process can be applied forseparation or singulation of the isolated pads 212 and internalconnectors 318 in the encapsulation 102 without the need for separationor singulation from the sides of the die attach paddle 210 and providinga significantly lower cost than equivalent laminate packages.

Referring now to FIG. 4, therein is shown a top plan view of anintegrated circuit packaging system 400 in a frame formation phase of asecond embodiment of the present invention. A detailed portion of theintegrated circuit packaging system 400 is shown for clarity. The topplan view depicts the dam bars 316 that can connect the externalconnectors 106 and the internal connectors 318. The dam bars 316 canalso be connected to the isolated pads 212 by the fused connectors 320.The top plan view further depicts the die attach paddle 210 attached toa tie bar 428.

A lead frame 402 can include the die attach pad 210, the isolated pads212, the tie bar 428, the internal connectors 318, the externalconnectors 106, and the dam bars 316. The lead frame 402 providesstructural integrity and substantially fixed locations for the dieattach pad 210, the isolated pads 212, the internal connectors 318, andthe external connectors 106 during processing. The tie bar 428 and thedam bars 316 can be at least partially removed to provide the die attachpad 210, the isolated pads 212, the internal connectors 318, and theexternal connectors 106 separated or singulated.

The isolated pads 212 can be separated, isolated, or singulated from theinternal connectors 318 and the external connectors 106 by removal of atleast a portion of the dam bars 316. At least a portion of the dam bars316 can be removed by removal processes such as cutting, sawing,etching, or other removal technologies without applying a separationprocess to the die attach paddle 210 thereby maintaining structuralintegrity of the die attach paddle 210 particularly edge regions.

Referring now to FIG. 5, therein is shown a cross-sectional view of theintegrated circuit packaging system 400 taken along line 5--5 of FIG. 4.The cross-sectional view depicts the dam bars 316 connecting theexternal connectors 106 and the internal connectors 318. For purposes ofillustration, a plane of the die attach paddle 210 is depicted below aplane of the dam bars 316 although it is understood that the die attachpaddle 210 and the dam bars 316 may be formed differently.

Referring now to FIG. 6, therein is shown is a cross-sectional view ofthe integrated circuit packaging system 400 taken along line 6--6 ofFIG. 4. The cross-sectional view depicts the fused connectors 320connecting the dam bars 316 with the isolated pads 212. The fusedconnectors 320 can be down set for connection to the isolated pads 212having a side in a plane different or not coplanar to a plane of a sideof the dam bars 316.

An attachment surface of the die attach paddle 210 is depicted having aplane of an attachment surface lower than a plane of the dam bars 316.Further, a plane of the attachment surface of the die attach paddle 210is substantially coplanar with a plane of a connection surface of theisolated pads 212.

Referring now to FIG. 7, therein is shown a cross-sectional view of anintegrated circuit packaging system 700 a third embodiment of thepresent invention. In a manner similar to the integrated circuitpackaging system 100 of FIG. 3, the encapsulation 102 provides theexternal connectors 106 partially exposed and extended from the lateralside 314 of the encapsulation 102.

The dam bars 316 connect the external connectors 106 and the internalconnectors 318, such as leads. The dam bars 316 are also connected tothe isolated pads 212 by the fused connectors 320. Preferably the fusedconnectors 320 are down set so to connect the isolated pads 212 that arein a different plane and not coplanar with the dam bars 316. Theisolated pads 212 are provided adjacent the die attach paddle 210.

The cross-sectional view further depicts the integrated circuit die 322attached to the die attach paddle 210 with the adhesive 324. Theelectrical interconnects 326 can electrically connect and physicallyattach the integrated circuit die 322 to the die attach paddle 210, theisolated pads 212 and the internal connectors 318.

The encapsulation 102 covers the integrated circuit die 322, theelectrical interconnects 326, the internal connectors 318, the fusedconnectors 320, the die attach paddle 210, and the isolated pads 212.The encapsulation second side 208 can substantially enclose and protectthe die attach paddle 210 and the isolated pads 212.

Referring now to FIG. 8, therein is shown a cross-sectional view of anintegrated circuit packaging system 800 in a fourth embodiment of thepresent invention. The cross-sectional view depicts the encapsulation102 with the external connectors 106 extending from the lateral side 314of the encapsulation 102.

The dam bars 316 connect the external connectors 106 and the internalconnectors 318. The dam bars 316 are also connected to the isolated pads212 by the fused connectors 320. The isolated pads 212 are formedadjacent to the die attach paddle 210.

The cross-sectional view further depicts the integrated circuit die 322attached to the die attach paddle 210 with the adhesive 324. Theelectrical interconnects 326 electrically connect and physically attachthe integrated circuit die 322 to the die attach paddle 210, theisolated pads 212 and the internal connectors 318.

The encapsulation 102 covers the integrated circuit die 322, theelectrical interconnects 326, the internal connectors 318, the fusedconnectors 320, and the isolated pads 212. The encapsulation 102partially covers the die attach paddle 210, substantially exposing aside of the die attach paddle 210 from the encapsulation second side208. The encapsulation second side 208 can substantially enclose andprotect the isolated pads 212.

Referring now to FIG. 9, therein is shown a cross-sectional view of anintegrated circuit packaging system 900 in a fifth embodiment of thepresent invention. The cross-sectional view depicts the encapsulation102 having the external connectors 106 extending from the lateral side314 of the encapsulation 102. The dam bars 316 connect the externalconnectors 106 and the internal connectors 318.

The cross-sectional view also depicts the isolated pads 212 formedadjacent the die attach paddle 210. The isolated pads 212 are connectedto opposite sides of connecting bars 930 formed adjacent the die attachpaddle 210. At least one of the isolated pads 212 can be formed facing aside of the die attach paddle 210. For purposes of illustration, two ofthe isolated pads 212 can be formed adjacent each side of the die attachpaddle 210, although it is understood that any number or configurationof the isolated pads 212 may be formed.

The cross-sectional view further depicts the integrated circuit die 322attached to the die attach paddle 210 with the adhesive 324. Theelectrical interconnects 326 electrically attach the integrated circuitdie 322 to the die attach paddle 210, the isolated pads 212 and theinternal connectors 318.

The encapsulation 102 covers the integrated circuit die 322, theinternal connectors 318 and the electrical interconnects 326. Theencapsulation 102 partially covers the die attach paddle 210, theisolated pads 212 and the connecting bars 930, substantially exposing aside of the die attach paddle 210 and the isolated pads 212 from theencapsulation second side 208. The encapsulation second side 208 canoptionally provide a side of the connecting bars 930 substantiallyexposed.

Referring now to FIG. 10, therein is shown a cross-sectional view of anintegrated circuit packaging system 1000 in a sixth embodiment of thepresent invention taken along line 10-10 of FIG. 11. The cross-sectionalview depicts the encapsulation 102 with the external connectors 106extending from the lateral side 314 of the encapsulation 102. The dambars 316 connect the external connectors 106 and the internal connectors318.

The cross-sectional view also depicts the isolated pads 212 formedadjacent to the die attach paddle 210. The isolated pads 212 areseparated by a cavity 1032, such as a cut line, saw channel, with aprocess such as partial sawing, chemical etching or laser drilling. Thecavity 1032 and thereby the isolated pads 212 can be formed without theneed for a removal process applied to the die attach paddle 210.

The cross-sectional view further depicts the integrated circuit die 322attached to the die attach paddle 210 with the adhesive 324. Theelectrical interconnects 326 electrically attach the integrated circuitdie 322 to the die attach paddle 210, the isolated pads 212 and theinternal connectors 318.

The encapsulation 102 covers the integrated circuit die 322, theinternal connectors 318 and the electrical interconnects 326. Theencapsulation 102 partially covers the die attach paddle 210 and theisolated pads 212 substantially exposing a side of the die attach paddle210 and the isolated pads 212, from the encapsulation second side 208.

Referring now to FIG. 11, therein is shown a bottom plan view of theintegrated circuit packaging system 1000. The bottom view depicts theencapsulation 102 with the encapsulation second side 208. The externalconnectors 106 are partially exposed and extending peripherally from theencapsulation 102. The isolated pads 212 are provided having a spacingfrom the periphery of the encapsulation 102. The isolated pads 212 areseparated by the cavity 1032. A side of the isolated pads 212 and thedie attach paddle 210 are substantially exposed from the encapsulationsecond side 208.

Referring now to FIG. 12, therein is shown a top plan view of theintegrated circuit packaging system 1000 in a frame formation phase. Adetailed portion of the integrated circuit packaging system 1000 isshown for clarity. The top plan view depicts the dam bars 316 thatconnect the external connectors 106 and the internal connectors 318. Thetop plan view further depicts the die attach paddle 210 attached to thetie bar 428. The tie bar 428 is connected to the connecting bars 930which connect the isolated pads 212.

The connecting bars 930 and a portion of the tie bar 428 can be thinnedby processing such as half etching, stamping, or other thinning process.The thinned portions of the connecting bars 930 and the tie bar 428 canprovide separation, isolation, or singulation of the isolated pads 212without applying a removal process to the die attach paddle 210 therebymaintaining structural integrity of the die attach paddle 210particularly edge regions.

Referring now to FIG. 13, therein is shown a top plan view of anintegrated circuit packaging system 1300 in a frame formation phase of aseventh embodiment of the present invention. The integrated circuitpackaging system 1300 can include a down set portion 1302. The dieattach paddle 210, the isolated pads 212, a portion of the tie bar 428,and a portion of the fused connectors 320 can be formed in one or moreplane planes below a plane of the internal connectors 318 or theexternal connectors 106.

The connecting bars 930 and a portion of the tie bar 428 can be thinnedby processing such as half etching, stamping, or other thinning process.The thinned portions of the connecting bars 930 and the tie bar 428 canprovide separation, isolation, or singulation of the isolated pads 212without applying a removal process to the die attach paddle 210 therebymaintaining structural integrity of the die attach paddle 210particularly edge regions.

The isolated pads 212 can further be separated, isolated, or singulatedfrom the internal connectors 318 and the external connectors 106 byremoval of at least a portion of the dam bars 316. At least a portion ofthe dam bars 316 can be removed by removal processes such as cutting,sawing, etching, or other removal technologies.

The top plan view depicts the dam bars 316 that connect the externalconnectors 106 and the internal connectors 318. The top plan viewfurther depicts the die attach paddle 210 attached to the tie bar 428.The tie bar 428 is connected to the connecting bars 930 which connectthe isolated pads 212. The fused connectors 320 connects the isolatedpads 212, provided between the die attach paddle 210 and the internalconnectors 318, to the dam bars 316.

Referring now to FIG. 14 therein is shown a bottom plan view of anintegrated circuit packaging system 1400 in an eighth embodiment of thepresent invention. The integrated circuit packaging system 1400 caninclude the isolated pads 212 formed inside the cavity 1032 whereby thecavity 1032 is on a side of the isolated pads 212 opposite the dieattach paddle 210. A side along the length of the isolated pads 212 canbe adjacent or facing the die attach paddle 210. The cavity 1032 canprovide electrical isolation of the isolated pads 212 and the die attachpaddle 210.

The bottom view depicts the encapsulation 102 with the encapsulationsecond side 208. The external connectors 106 are partially exposed andextending peripherally from the encapsulation 102. The bottom view alsodepicts a side of the die attach paddle 210 substantially exposed fromthe encapsulation second side 208. The isolated pads 212 are providedaway from the periphery of the encapsulation 102 between the cavity 1032and the die attach paddle 210. The isolated pads 212 can besubstantially exposed from the encapsulation second side 208.

Referring now to FIG. 15, therein is shown a bottom plan view of anintegrated circuit packaging system 1500 in a ninth embodiment of thepresent invention. The integrated circuit packaging system 1500 caninclude the isolated pads 212 formed outside the cavity 1032 whereby thecavity 1032 is between a side of the isolated pads 212 and a side of thedie attach paddle 210. A side along the length of the isolated pads 212can be adjacent or facing the cavity 1032 and the die attach paddle 210.The cavity 1032 can intervene between the isolated pads 212 and the dieattach paddle 210 and provide electrical isolation of the isolated pads212 and the die attach paddle 210.

The bottom view depicts the encapsulation 102 with the encapsulationsecond side 208. The external connectors 106 are partially exposed andextending peripherally from the encapsulation 102. The bottom view alsodepicts the die attach paddle 210 exposed from the encapsulation secondside 208. The isolated pads 212 are provided away from the periphery ofthe encapsulation 102 between the external connectors 106 and the cavity1032. The isolated pads 212 are exposed from the encapsulation secondside 208.

Referring now to FIG. 16, therein is shown a bottom plan view of anintegrated circuit packaging system 1600 in a tenth embodiment of thepresent invention. The integrated circuit packaging system 1600 caninclude the isolated pads 212 formed on opposite sides of the cavity1032 whereby the cavity 1032 is between the isolated pads 212. A sidealong the length of the isolated pads 212 can be adjacent or facing thedie attach paddle 210. A portion of the cavity 1032 can have a sideadjacent or facing a side of the die attach paddle 210 without thecavity 1032 intervening. The cavity 1032 can intervene between theisolated pads 212 to provide electrical isolation of the isolated pads212 and the die attach paddle 210.

The bottom view depicts the encapsulation 102 with the encapsulationsecond side 208. The external connectors 106 are partially exposed andextending peripherally from the encapsulation 102. The bottom view alsodepicts the die attach paddle 210 exposed from the encapsulation secondside 208. The isolated pads 212 are provided away from the periphery ofthe encapsulation 102. The isolated pads 212 are provided on either sideof the cavity 1032 in a staggered formation.

Referring now to FIG. 17, therein is shown a top plan view of anintegrated circuit packaging system 1700 in an eleventh embodiment ofthe present invention. The top view depicts the encapsulation 102 havingthe encapsulation first side 104. The encapsulation 102 covers andprotects the isolated pads 212 and the die attach paddle. For purposesof illustration, the encapsulation 102 is shown in a shape of a squarealthough it is understood that the encapsulation 102 may be of any shapeor size.

Referring now to FIG. 18, therein is shown a bottom plan view of theintegrated circuit packaging system 1700. The bottom view depicts theencapsulation 102 with the encapsulation second side 208. The internalconnectors 318 are partially exposed from the encapsulation second side208, but do not extend peripherally from an outer extent of theencapsulation 102. Thus, the internal connectors 318 can have anexternal edge substantially exposed but not extending from an edge ofthe encapsulation 102. The internal connectors 318, for example, can beleads, external connections, or external conductors, for the integratedcircuit packaging system 1700 in a quad flat no leads package type.

The bottom view also depicts a die attach paddle 110 exposed from theencapsulation second side 208. The isolated pads 212 are provided awayfrom the periphery of the encapsulation 102. The isolated pads 212 areexposed from the encapsulation second side 208.

Referring now to FIG. 19, therein is shown a cross-sectional view of theintegrated circuit packaging system 1700 taken along line 19-19 of FIG.17. The cross-sectional view depicts the encapsulation 102 having theinternal connectors 318 exposed from the encapsulation second side 208.The internal connectors 318 are connected to the dam bars 316. The dambars 316 are connected to the isolated pads 212 by the fused connectors320. The fused connectors 320 are coplanar with the dam bars 316 and theisolated pads 212. The isolated pads 212 are formed adjacent to the dieattach paddle 210.

The cross-sectional view further depicts the integrated circuit die 322attached to the die attach paddle 210 with the adhesive 324. Theelectrical interconnects 326 electrically attach the integrated circuitdie 322 to the die attach paddle 210, the isolated pads 212 and theinternal connectors 318. The encapsulation 102 covers the integratedcircuit die 322 and the electrical interconnects 326. The encapsulation102 partially covers the die attach paddle 210, the isolated pads 212and the internal connectors 318 exposing the die attach paddle 210, theisolated pads 212 and the internal connectors 318 from the encapsulationsecond side 208.

In a manner similar to the integrated circuit packaging system 400, theisolated pads 212 can be separated, isolated, or singulated from theinternal connectors 318 and the external connectors 106 by removal of atleast a portion of the dam bars 316. At least a portion of the dam bars316 can be removed by removal processes such as cutting, sawing,etching, or other removal technologies without applying a separationprocess to the die attach paddle 210 thereby maintaining structuralintegrity of the die attach paddle 210 particularly edge regions.

Referring now to FIG. 20, therein is shown a flow chart of a method 2000of manufacture of an integrated circuit packaging system 100 in afurther embodiment of the present invention. The method 2000 includes:providing a lead frame having a die attach paddle, an isolated pad, anda connector in a block 2002; attaching an integrated circuit die to thedie attach paddle and the connector in a block 2004; forming anencapsulation over the integrated circuit die, the connector, the dieattach paddle, and the isolated pad a block 2006; and singulating theconnector and the die attach paddle whereby the isolated pads areelectrically isolated in a block 2008.

Thus, it has been discovered that the integrated circuit die packagingsystem of the present invention furnishes important and heretoforeunknown and unavailable solutions, capabilities, and functional aspectsfor aspects for improving yield, increasing reliability, and reducingcost of integrated circuit packages with leaded configurations. Theresulting processes and configurations are straightforward,cost-effective, uncomplicated, highly versatile, accurate, sensitive,and effective, and can be implemented by adapting known components forready, efficient, and economical manufacturing, application, andutilization.

Another important aspect of the present invention is that it valuablysupports and services the historical trend of reducing costs,simplifying systems, and increasing performance.

These and other valuable aspects of the present invention consequentlyfurther the state of the technology to at least the next level.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations that fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

1. A method of manufacture of an integrated circuit packaging systemcomprising: providing a lead frame having a die attach paddle, anisolated pad, and a connector; attaching an integrated circuit die tothe die attach paddle and the connector; forming an encapsulation overthe integrated circuit die, the connector, the die attach paddle, andthe isolated pad; and singulating the connector and the die attachpaddle includes removing a portion of a fused connector attached to theisolated pad and a dam bar whereby the isolated pads are electricallyisolated.
 2. The method as claimed in claim 1 wherein singulating theconnector and the die attach paddle includes removing a portion of a tiebar attached to the isolated pad and the die attach paddle.
 3. Themethod as claimed in claim 1 wherein singulating the connector and thedie attach paddle includes removing a portion of a connecting barattached to the isolated pad and a second isolated pad.
 4. The method asclaimed in claim 1 wherein singulating the connector and the die attachpaddle includes removing a portion of a fused connector attached to theisolated pad, the isolated pad formed with a down set from the fusedconnector.
 5. A method of manufacture of an integrated circuit packagingsystem comprising: providing a lead frame having a die attach paddle, anisolated pad, and a connector; mounting an integrated circuit die to thedie attach paddle; attaching an electrical interconnect to theintegrated circuit die, the isolated pad, and the connector; forming anencapsulation over the integrated circuit die, the connector, the dieattached paddle, and the isolated pad; and singulating the connector andthe die attach paddle includes removing a portion of a fused connectorattached to the isolated pad and a dam bar whereby the isolated pads areelectrically isolated.
 6. The method as claimed in claim 5 whereinforming an encapsulation includes forming an encapsulation providing aside of the isolated pad substantially exposed.
 7. The method as claimedin claim 5 wherein forming an encapsulation includes forming anencapsulation providing a side of the die attach pad substantiallyexposed.
 8. The method a claimed in claim 5 wherein forming anencapsulation includes forming an encapsulation providing a side of theisolated pad substantially exposed and a side of the die attach padsubstantially exposed.
 9. The method as claimed in claim 5 furthercomprising forming a second isolated pad separated from the isolated padby a cavity.